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Investigations on the thermal and electrical conductivity of polyethylene glycol-based CuO and ZnO nanofluids

dc.contributor.authorPonmani, Swaminathan
dc.contributor.authorGupta, Pawan
dc.contributor.authorJadhawar, Prashant Sopanrao
dc.contributor.authorNagarajan, R
dc.contributor.authorSangwai, Jitendra
dc.date.accessioned2020-10-22T23:04:24Z
dc.date.available2020-10-22T23:04:24Z
dc.date.issued2019-10-23
dc.identifier.citationPonmani , S , Gupta , P , Jadhawar , P S , Nagarajan , R & Sangwai , J 2019 , ' Investigations on the thermal and electrical conductivity of polyethylene glycol-based CuO and ZnO nanofluids ' , Indian Chemical Engineer . https://doi.org/10.1080/00194506.2019.1677513en
dc.identifier.issn0975-007X
dc.identifier.otherPURE: 144876858
dc.identifier.otherPURE UUID: 55105138-5f5f-4ff6-9afc-8c04d6c01013
dc.identifier.otherScopus: 85074524673
dc.identifier.otherORCID: /0000-0002-2049-0460/work/86450061
dc.identifier.urihttps://hdl.handle.net/2164/15274
dc.language.isoeng
dc.relation.ispartofIndian Chemical Engineeren
dc.rightsThis is an Accepted Manuscript of an article published by Taylor & Francis in Indian Chemical Engineer on 23 Oct 2019, available online: http://www.tandfonline.com/10.1080/00194506.2019.1677513en
dc.subjectElectrical conductivityen
dc.subjectNanofluidsen
dc.subjectStabilityen
dc.subjectThermal Conductivityen
dc.subjectNan's Modelen
dc.subjectNan’s modelen
dc.subjectnanofluidsen
dc.subjectthermal conductivityen
dc.subjectstabilityen
dc.subjectTA Engineering (General). Civil engineering (General)en
dc.subjectChemical Engineering(all)en
dc.subject.lccTAen
dc.titleInvestigations on the thermal and electrical conductivity of polyethylene glycol-based CuO and ZnO nanofluidsen
dc.typeJournal articleen
dc.contributor.institutionUniversity of Aberdeen.Engineeringen
dc.description.statusPeer revieweden
dc.description.versionPostprinten
dc.identifier.doihttps://doi.org/10.1080/00194506.2019.1677513
dc.date.embargoedUntil2020-10-23
dc.identifier.urlhttp://www.scopus.com/inward/record.url?scp=85074524673&partnerID=8YFLogxKen


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